November 14, 2008 - Bosch Rexroth’s semiconductor industry brochure offers an array of information to help tool builders and fab operators increase efficiency by reducing cycle time, maximizing uptime, boosting fab throughput, and improving productivity. Available for free download, the new brochure highlights how Bosch Rexroth Electric Drive and Controls, Linear Motion, Assembly, and Pneumatic products and technologies can be applied in application areas such as wafer handling, chip handling, metrology, wire bonding, and photovoltaic production.
For example, the brochure explains how modular systems provide cost benefits by utilizing flexible components and subassemblies that reduce tool design and assembly time.
Motion and control capabilities and subsystems are also highlighted in the brochure, demonstrating how they can help customers achieve cost-effective solutions and enable OEMs to focus on their core competencies.
For process efficiency, the brochure details how pneumatics can help with high precision, fast response times and lower maintenance costs.
Readers will also learn how highly accurate, interchangeable, and maintenance-free linear motion components help reduce total cost of ownership.
As part of the Robert Bosch Group, Bosch Rexroth has years of in-house experience related to semiconductor manufacturing. Rexroth’s proven electronic, pneumatic, linear motion and assembly technologies are engineered to work together, helping customers reduce cycle time, maximize uptime, boost fab throughput, and improve productivity. In addition, the company offers unique value as a global partner with excellent local resources focused on helping customers get the most out of their production systems.
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